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<Article>
<Journal>
				<PublisherName>Amirkabir University of Technology</PublisherName>
				<JournalTitle>AUT Journal of Mechanical Engineering</JournalTitle>
				<Issn>2588-2937</Issn>
				<Volume>10</Volume>
				<Issue>3</Issue>
				<PubDate PubStatus="epublish">
					<Year>2026</Year>
					<Month>07</Month>
					<Day>01</Day>
				</PubDate>
			</Journal>
<ArticleTitle>Recent Developments in Carbon based and Graphene based Thermal Interface Materials: A Review</ArticleTitle>
<VernacularTitle></VernacularTitle>
			<FirstPage>255</FirstPage>
			<LastPage>268</LastPage>
			<ELocationID EIdType="pii">5971</ELocationID>
			
<ELocationID EIdType="doi">10.22060/ajme.2026.24363.6196</ELocationID>
			
			<Language>EN</Language>
<AuthorList>
<Author>
					<FirstName>Amol Radhakisan</FirstName>
					<LastName>Dhumal</LastName>
<Affiliation>Department of Mechanical Engineering, Vishwakarma Institute of Technology, SPPU, Pune-411037, India</Affiliation>
<Identifier Source="ORCID">0009-0005-1948-7263</Identifier>

</Author>
<Author>
					<FirstName>Atul</FirstName>
					<LastName>Kulkarni</LastName>
<Affiliation>Department of Mechanical Engineering, Vishwakarma Institute of Technology, SPPU, Pune-411037, India</Affiliation>
<Identifier Source="ORCID">0000-0002-6452-6349</Identifier>

</Author>
<Author>
					<FirstName>Nitin</FirstName>
					<LastName>Ambhore</LastName>
<Affiliation>Department of Mechanical Engineering, Vishwakarma Institute of Technology, SPPU, Pune-411037, India</Affiliation>
<Identifier Source="ORCID">0000-0001-8468-8057</Identifier>

</Author>
</AuthorList>
				<PublicationType>Journal Article</PublicationType>
			<History>
				<PubDate PubStatus="received">
					<Year>2025</Year>
					<Month>07</Month>
					<Day>07</Day>
				</PubDate>
			</History>
		<Abstract>This review presents a comprehensive and critical evaluation of carbon-based and graphene-based thermal interface materials (TIMs) for advanced thermal management in electronic systems. Conventional TIMs typically exhibit thermal conductivities in the range of 0.1–10 W/m·K, limiting their effectiveness in high-power and miniaturized devices. In contrast, carbon-based TIMs demonstrate significantly enhanced performance, with carbon nanotube (CNT) composites achieving 8–12 W/m·K and graphene-based composites reaching up to 23.2 W/m·K at 60 wt% loading. We provide a detailed comparative analysis of CNT and graphene architectures, emphasizing their exceptional intrinsic thermal conductivities (~3000 W/m·K for CNTs and ~5000 W/m·K for graphene) and addressing practical challenges such as interfacial resistance, dispersion uniformity, and large-scale integration. The review synthesizes fabrication strategies, performance trends, and application-specific considerations, while outlining future directions including hybrid architectures, eco-friendly formulations, and cost-effective, scalable manufacturing techniques. By integrating quantitative comparisons and identifying critical research gaps, this work offers a roadmap for next-generation TIM development aimed at a high-power electronics, telecommunications, and computing systems, where efficient thermal management is essential for reliability, energy efficiency, and long-term operational performance.</Abstract>
		<ObjectList>
			<Object Type="keyword">
			<Param Name="value">Contact resistance</Param>
			</Object>
			<Object Type="keyword">
			<Param Name="value">Microelectronics</Param>
			</Object>
			<Object Type="keyword">
			<Param Name="value">Electronics packaging</Param>
			</Object>
			<Object Type="keyword">
			<Param Name="value">Phase-change materials</Param>
			</Object>
			<Object Type="keyword">
			<Param Name="value">elastic modulus</Param>
			</Object>
		</ObjectList>
<ArchiveCopySource DocType="pdf">https://ajme.aut.ac.ir/article_5971_73983c01982794632e0270cd0006d407.pdf</ArchiveCopySource>
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